11th. Int. Conf. on Thermal, Mechanical, and Multiphysics Simulation and Experiments in Micro-Electronics and Micro-Systems, EuroSimE 2010, (electronic resource)

Resource Information

The instance 11th. Int. Conf. on Thermal, Mechanical, and Multiphysics Simulation and Experiments in Micro-Electronics and Micro-Systems, EuroSimE 2010, (electronic resource) represents a material embodiment of a distinct intellectual or artistic creation found in Engineer Research and Development Center Library. This resource is a combination of several types including: Instance, Electronic.

Label

11th. Int. Conf. on Thermal, Mechanical, and Multiphysics Simulation and Experiments in Micro-Electronics and Micro-Systems, EuroSimE 2010, (electronic resource)

Link

http://ieeexplore.ieee.org/servlet/opac?punumber=5457934

Medium

electronic resource

Instantiates

• 11th. Int. Conf. on Thermal, Mechanical, and Multiphysics Simulation and Experiments in Micro-Electronics and Micro-Systems, EuroSimE 2010

Publication

• Piscataway, N.J., IEEE, c2010

Note

Title from foot of PDF paper (IEEE Xplore, viewed on Nov. 1, 2010)

Bibliography note

Includes bibliographical references

Control code

ocn676716079

Extent

1 online resource

Form of item

online

Other physical details

ill.

Record ID

u234342

Specific material designation

remote

System control number

(OCoLC)676716079