11th. Int. Conf. on Thermal, Mechanical, and Multiphysics Simulation and Experiments in Micro-Electronics and Micro-Systems, EuroSimE 2010, (electronic resource)

The Resource 11th. Int. Conf. on Thermal, Mechanical, and Multiphysics Simulation and Experiments in Micro-Electronics and Micro-Systems, EuroSimE 2010, (electronic resource)

Label: 11th. Int. Conf. on Thermal, Mechanical, and Multiphysics Simulation and Experiments in Micro-Electronics and Micro-Systems, EuroSimE 2010, (electronic resource)

Link: http://ieeexplore.ieee.org/servlet/opac?punumber=5457934

Medium: electronic resource

Instantiates

11th. Int. Conf. on Thermal, Mechanical, and Multiphysics Simulation and Experiments in Micro-Electronics and Micro-Systems, EuroSimE 2010

Publication

Piscataway, N.J., IEEE, c2010

Note: Title from foot of PDF paper (IEEE Xplore, viewed on Nov. 1, 2010)

Bibliography note: Includes bibliographical references

Control code: ocn676716079

Extent: 1 online resource

Form of item: online

Other physical details: ill.

Specific material designation: remote

System control number: (OCoLC)676716079

Context

Context of 11th. Int. Conf. on Thermal, Mechanical, and Multiphysics Simulation and Experiments in Micro-Electronics and Micro-Systems, EuroSimE 2010, (electronic resource)

Structured data from the Bibframe namespace is licensed under the Creative Commons Attribution 4.0 International License by Engineer Research and Development Center Library. Additional terms may apply to data associated with third party namespaces.

Link Analysis (Experimental)

11th. Int. Conf. on Thermal, Mechanical, and Multiphysics Simulation and Experiments in Micro-Electronics and Micro-Systems, EuroSimE 2010, (electronic resource)

Local Identifier: http://engineerradcc.library.link/resource/Bk3Vf-aBKUI/

Network Identifier: http://library.link/resource/Bk3Vf-aBKUI/

Resource Description Namespaces

Network Analysis

Inbound Links: 0 0 Total

Outbound Links: 4 3 Total
3 To Library based on 2 Link Types

1 To Web based on 1 Link Type

Shared Resources: 0 1 Total

0 Inbound and 1 Outbound

Shared in Network

As of 2017-08-15 at 19:49

The resource is rare in The Library.Link Network.

11th. Int. Conf. on Thermal, Mechanical, and Multiphysics Simulation and Experiments in Micro-Electronics and Micro-Systems, EuroSimE 2010, (electronic resource)

Context

Items

Work

11th. Int. Conf. on Thermal, Mechanical, and Multiphysics Simulation and Experiments in Micro-Electronics and Micro-Systems, EuroSimE 2010, (electronic resource)

Resource Description Namespaces

Network Analysis

Shared in Network